| abstract |
(57) Abstract: Provided is an ultraviolet curable resin composition which has excellent heat resistance of a cured product and can improve solder heat resistance particularly when used as a photo solder resist ink for manufacturing a printed wiring board. I do. [MEANS FOR SOLVING PROBLEMS] An ultraviolet curable resin having a carboxyl group and two or more ethylenically unsaturated groups in one molecule, B. An epoxy compound having two or more epoxy groups in one molecule, C.I. Finely divided polyimide resin; A photopolymerization initiator; Contains diluent. |