http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002517903-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-1089 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-0272 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76856 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76862 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76876 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-02 |
| filingDate | 1999-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2002-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002517903-A |
| titleOfInvention | Plasma treatment to fill contacts elsewhere |
| abstract | SUMMARY The present invention provides a method and apparatus for filling contacts, vias, trenches, and other patterns on a substrate surface, particularly those having a high aspect ratio. In general, the present invention provides a method for removing oxygen from the surface of an oxidized metal layer prior to subsequent metal deposition. The oxidized metal is treated with a plasma comprising nitrogen, hydrogen, or a mixture thereof. In one aspect of the invention, the metal layer (22) is Ti, TiN, Ta, TaN, Ni, NiV, or V, followed by a wetting layer (28) of CVD aluminum (Al) or copper (Cu). It is deposited using either a CVD technique or electroplating, such as electroplating. The metal layer (22) can be exposed to oxygen or air and then treated with two or more cycles of a nitrogen and / or hydrogen plasma to remove oxidation of the surface of the metal layer (22) or And nucleates subsequent growth of the metal layer (28, 30). |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011222600-A |
| priorityDate | 1998-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 38.