| abstract |
(57) [Problem] To provide a resin composition for semiconductor encapsulation in which a cured body has an electromagnetic wave shielding function and an insulating property and has good moldability. SOLUTION: The resin composition for semiconductor encapsulation is configured to include a magnetic powder and a silica powder having an average particle diameter smaller than the average particle diameter of the magnetic powder. As a result, the cured product of the resin composition for semiconductor encapsulation has an electromagnetic wave shielding function due to the magnetic powder, and the gap between the magnetic powders is filled with silica powder having a small average particle diameter, and the moldability is improved. , The insulating property is increased. By using such a semiconductor sealing resin composition, it has an electromagnetic wave shielding function, In addition, it is possible to manufacture a well-formed and sealed semiconductor device in which a malfunction due to a leakage current from a semiconductor element does not occur. |