| abstract |
(57) [Abstract] [Problem] Non-halogen and non-antimony, moldability, Epoxy resin material for sealing with good flame retardancy without reducing reliability such as reflow resistance, moisture resistance, and high temperature storage characteristics, And an electronic component device provided with a sealed element. An epoxy resin molding material for sealing comprising (A) an epoxy resin, (B) an aluminum hydroxide coated with a curing agent and (C) an epoxy resin as essential components, and an epoxy resin molding material for this sealing Electronic device provided with an element sealed by the above. |