| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate |
2000-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2734ad61dedaae0120a04c766000f23 |
| publicationDate |
2002-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2002105239-A |
| titleOfInvention |
Surface-treated inorganic filler, epoxy resin composition and semiconductor device |
| abstract |
(57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation excellent in moldability and solder resistance. An epoxy resin (A), a phenol resin (B), a curing accelerator (C), and an inorganic filler (D) are surface-treated with a compound having at least one epoxy group in a molecule and an organoaluminum compound. An epoxy resin composition for semiconductor encapsulation, comprising a surface-treated inorganic filler comprising: |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7308473-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002220514-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020041109-A |
| priorityDate |
2000-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |