http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002208686-A

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filingDate 2001-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3dabe812b52eae921d850fcd9f25f827
publicationDate 2002-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002208686-A
titleOfInvention Method for manufacturing solid-state imaging device
abstract (57) [Summary] A second transfer electrode is provided on a first transfer electrode of a CCD transfer register. When a transfer electrode is formed by plasma etching, an etching residue is effectively removed, and unnecessary removal of a base film is prevented. SOLUTION: A cross section of a first transfer electrode is substantially vertical, A laminated high-melting-point metal polycide film serving as a second transfer electrode is formed on a step part of which overhangs, and plasma etching is performed in three stages. In the first plasma etching step, just etching is performed using a mixed gas of sulfur hexafluoride, chlorine and methane difluoride. In the second plasma etching step, a mixed gas of sulfur hexafluoride, chlorine and methane difluoride is used, and overetching is performed with low substrate bias power. In the third plasma etching step, over-etching is performed using a mixed gas of sulfur hexafluoride and chlorine and setting the substrate bias power to 0 w.
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