http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002190469-A

Outgoing Links

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40
filingDate 2000-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5fef939fc25969cf436203de88831c72
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95fffffcf02e4782af0b68ea7856ce54
publicationDate 2002-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002190469-A
titleOfInvention Method of forming contact hole
abstract (57) Abstract: In a method for forming a fine contact hole, an excellent method for forming a contact hole in which a chemically amplified resist film and an antireflection film are not peeled off is provided. SOLUTION: The resist film is irradiated with far ultraviolet rays after forming a resist pattern to generate degass from the resist film and the anti-reflection film in advance, and then dry etching for forming a contact hole is performed using a freon-based gas. Further, the antireflection film is prevented from peeling from the underlying semiconductor substrate.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109597245-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012164810-A
priorityDate 2000-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 24.