http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002179774-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e43b4ca6b41ce9f54c9a895d474c81a |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate | 2000-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b67d35fd6aa0a02f7318fec0201dfb5c |
| publicationDate | 2002-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002179774-A |
| titleOfInvention | Epoxy resin, epoxy resin composition and cured product thereof |
| abstract | [PROBLEMS] An insulating material for electric and electronic parts (such as a highly reliable semiconductor encapsulating material) and a laminated board (printed wiring) having excellent flame retardancy and heat resistance despite being low halogen or non-halogen. To provide useful materials for various composite materials including CFRP, boards, build-up substrates, etc., adhesives, paints, etc. SOLUTION: Formula (1) An epoxy resin obtained by dehydration-condensation and polymerization of a compound having a phenolic hydroxyl group and a methylol group and a compound having a phenolic hydroxyl group and a methylol group is used as a component of the epoxy resin composition, and the composition is cured. Depending on |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2016129655-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2018033950-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7138398-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016129655-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101520059-B1 |
| priorityDate | 2000-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 171.