http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002161196-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 2000-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0b8938ddc6c6f9db8ffe8f57a185e7e |
| publicationDate | 2002-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002161196-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (57) [Summary] [Problem] A semiconductor having excellent moldability such as fluidity and curability, excellent solder crack resistance, and excellent flame retardancy without blending a bromine compound or an antimony compound, and thus has excellent high-temperature storage characteristics. To provide an epoxy resin composition for sealing. SOLUTION: For semiconductor encapsulation, (A) a phenol aralkyl type epoxy resin, (B) an α-naphthol aralkyl resin, (C) an inorganic filler, and (D) a curing accelerator are essential components. Epoxy resin composition. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010095709-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018194154-A1 |
| priorityDate | 2000-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 43.