http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001151865-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
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filingDate 1999-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_73a8ccbdc483485d489b4dd8af576e3a
publicationDate 2001-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001151865-A
titleOfInvention Epoxy resin composition and semiconductor device
abstract (57) [Problem] To provide an epoxy resin composition excellent in solder resistance and flame retardancy. (A) 30 to 100% by weight of an epoxy resin represented by the general formula (1) based on the total amount of epoxy resin; (B) The resin curing agent represented by the general formula (2) is required to be 30 to 100% by weight based on the total amount of the resin curing agent, (C) fused silica powder, and (D) a curing accelerator as essential components. Characteristic epoxy resin composition for semiconductor encapsulation. Embedded image (In the formula, R 1 and R 2 are an alkyl group having 1 to 4 carbon atoms, a is an integer of 0 to 3, and b is an integer of 0 to 4, which may be the same or different. Is an average value and is a positive number of 1 to 10) Wherein R 3 is an alkyl group having 1 to 4 carbon atoms, and c is 0 to It is an integer of 3 and may be the same or different. X is a residue obtained by removing one hydrogen from the aromatic ring of a phenol or naphthol, and may be the same or different. m and n are average values, each of which is 0 to 10 positive number)
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002161196-A
priorityDate 1999-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 35.