| abstract |
(57) [Summary] (Modifications) [PROBLEMS] To effectively remove impurities on the surface of a semiconductor having copper wiring on the surface without causing corrosion or oxidation of the copper wiring and without causing surface roughness. A cleaning agent and a cleaning method that can be removed are provided. SOLUTION: In the molecule Having a group of, for example, a nonionic surfactant of the general formula 7, a cleaning agent for a semiconductor surface having copper wiring on the surface, a method for cleaning a semiconductor surface using the same, and treatment with the cleaning agent Semiconductor with copper wiring on the surface obtained. (P + q + p '+ q' is 1 to 20) |