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filingDate 1998-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2001-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001525613-A
titleOfInvention Titanium chemical vapor deposition on wafer including in-situ pre-cleaning step
abstract (57) [Summary]nA multi-step chemical vapor deposition method for depositing a titanium film on a substrate. The first step of the deposition process includes a plasma pretreatment step in which a pretreatment gas including a hydrogen-containing gas and an inert gas are flowed into a deposition area of the substrate processing chamber. During the first deposition step, a plasma is formed from the pre-treatment gas and maintained for at least about 5 seconds to etch any remaining insulating material in the contact areas of the substrate and to clean the contact areas before depositing the titanium layer. Next, during a second deposition step, a titanium-containing source and a reducing agent are introduced into the deposition area, the plasma formed in the first step is maintained, and a titanium layer on the substrate is deposited. In a preferred embodiment, the hydrogen-containing source contained in the pretreatment gas and the reducing agent in the treatment gas of the second deposition step are H Two Is the same continuous flow.
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