| abstract |
(57) [Problem] To prevent heat from escaping from a ceramic substrate, prevent warpage even when the ceramic substrate is heated to a high temperature, and form a hollow in a columnar member. In addition, the metal wire from the temperature measuring element provided on the ceramic substrate, the conductive wire connected to the resistance heating element, etc. can be easily pulled out of the supporting container, making it easy to assemble the device.・ Provide inspection equipment. SOLUTION: This is a semiconductor manufacturing / inspection apparatus in which a ceramic substrate provided with a conductor layer on its surface or inside is fixed on an upper part of a supporting container provided with a plate-like body. A semiconductor manufacturing method, wherein a columnar member is provided, and a porous body is interposed between the columnar member and the ceramic substrate and / or between the ceramic substrate and the support container.・ Inspection equipment. |