http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001345319-A

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filingDate 2000-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc490b6d72101d10bd8799ab15bee7a9
publicationDate 2001-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001345319-A
titleOfInvention Method for manufacturing semiconductor device
abstract (57) [Summary] [Problem] When moisture invades from a passivation film and a high voltage is applied between a source and a drain, device characteristics such as a decrease in withstand voltage of a semiconductor device and an increase in leak current due to the moisture occur. To provide a method for manufacturing a semiconductor device which prevents the occurrence of the problem. A method of manufacturing a semiconductor device according to the present invention includes: Forming a plasma TEOS oxide film 12 as a second insulating film on the semiconductor substrate 1 provided with an interlayer insulating film 9 as a first insulating film, a source electrode 10 and a drain electrode 11; There is a step of etching back so that the layer 12 remains in a stepped portion under the spacer, and a step of forming a plasma nitride film 13 as a third insulating film as a passivation film on the plasma TEOS oxide film 12.
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