http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001342574-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-26 |
| filingDate | 2000-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_94da9c7705eb46d351cad886daab793d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_070eeb461b3f6df27a361227c8489241 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c5c7c28e944bf324924d169aad74d705 |
| publicationDate | 2001-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001342574-A |
| titleOfInvention | Method for removing plating catalyst nuclei and method for manufacturing wiring board |
| abstract | (57) [Problem] To provide a plating catalyst nucleus removing method and a method of manufacturing a wiring board, which can improve insulation properties between wirings. Further, the present invention provides a plating catalyst nucleus removing method and a method for manufacturing a wiring board, which can reduce the number of steps. In a method of manufacturing a wiring board, plating catalyst nuclei are formed on surfaces of interlayer insulating layers (resins). 4 is formed. By using the plating catalyst core 4, an electroless plating layer 5A and an electrolytic plating layer 5B are sequentially formed to form a second wiring 5. Also, using the plating catalyst core 14, An electroless plating layer 15A and an electrolytic plating layer 15B are sequentially formed to form a second back wiring 15. Subsequently, oxidation treatment is performed on the unnecessary residues of the unnecessary plating catalyst nuclei 4 and 14, and the oxidized residues are removed with a plating catalyst removing solution. For the oxidation treatment, for example, an oxidizing agent such as a hydrogen peroxide solution, Hydrobromic acid or the like can be used for the plating catalyst removing solution. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105970226-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4715414-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160110099-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007088196-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006349995-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015516509-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101927679-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101063620-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4626850-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102762039-A |
| priorityDate | 2000-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 78.