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filingDate 2000-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2001-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001326259-A
titleOfInvention Probe card and method of manufacturing the same
abstract PROBLEM TO BE SOLVED: To provide a probe card for transmitting a signal between an integrated circuit and an external semiconductor test device in a test of a semiconductor integrated circuit. SOLUTION: This probe card 100 has a contact 9 2, a substrate 94, a signal transmission path 96, a ground conductor 98, and a hole 102. The signal transmission path 96 is formed on the substrate 94. The substrate 94 is formed of a dielectric material or a semiconductor material. The contact 92 is formed of a metallic glass material at one end of the substrate 94 at the tip of the signal transmission path 96. By utilizing the fine processing technology of the metallic glass material, the contact 92 can be formed very finely. The contact 92 is provided above the hole 102 and is formed separately from the substrate 94. The contact 92 It has elasticity in a direction perpendicular to the surface of the substrate 94, and can elastically contact the connection terminals formed on the circuit under test during the test. Probe card 1 of the present invention No. 00 is capable of transmitting a high-frequency signal to an integrated circuit having a large number of pads at a narrow pitch by forming the contacts 92 from a metallic glass material.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008155333-A
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