| abstract |
The present invention provides a probe contactor and a method for forming a contactor used for testing a semiconductor wafer, an LSI package, a printed circuit board, and the like formed on a plane of a substrate by a photolithography technique. A probe contactor includes a substrate having an interconnect trace serving as a conductive path on a surface thereof, and a contactor formed on the substrate by a photolithography method. The contactor has a base portion formed upright with respect to the substrate, a horizontal portion having one end formed on the base portion, and a contact portion formed at the other end of the horizontal portion. When the contactor is pressed against the component under test, a horizontal portion of the contactor creates a contact pressure. |