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filingDate 2001-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2001-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001314990-A
titleOfInvention Laser processing equipment and multilayer printed wiring board manufacturing equipment
abstract (57) [Problem] To provide a manufacturing apparatus and a manufacturing method of a multilayer printed wiring board capable of forming a via hole with a small diameter at low cost. SOLUTION: The laser light from a CO2 laser oscillator 60 is shortened in wavelength by a tellurium crystal 94 to suppress diffraction of the laser light and to reduce the limit value of the light collecting limit when the laser light is collected. The spot diameter of the laser beam is reduced, and a hole for a via hole is formed in the interlayer insulating resin on the substrate 10. For this reason, even when the output of the laser beam is increased to form a deep hole, the hole diameter is not increased, so that a small-diameter via hole can be formed.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011521233-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7603070-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014170004-A
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