| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_34c067d1bbfe85ac23d961d454a35d0e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81013 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| filingDate |
2000-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e27cd28e9000998282e484d22a38d09b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e62305437f53c7ef8e792e25d53a945d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dfa4082a00246cbb0466e431cb96ce7c |
| publicationDate |
2001-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2001308144-A |
| titleOfInvention |
Flip chip mounting method |
| abstract |
PROBLEM TO BE SOLVED: To provide an effective mounting method for realizing fluxless bonding in the air when an IC chip having solder bumps formed of lead-free solder is flip-chip mounted on a wiring board. I do. SOLUTION: The surface of a lead-free tin-zinc solder alloy forming a solder bump 12 of an IC chip 11 is modified. This modification removes the tin oxide film and the zinc oxide film on the surface of the solder bump 12 by irradiating the hydrogen-containing plasma 13 and forms a fluorine-containing layer on the surface of the solder bump 12 by the fluorine-containing plasma. Prevents reoxidation of zinc. After this modification, the solder bumps 12 of the IC chip 11 are directly mounted on the metal electrodes of the wiring board, and joined by a flip chip bonder. By modifying the oxide film layer of the solder bump 12 of a tin-zinc solder alloy, it is possible to perform fluxless joining between the solder bump 12 of the IC chip 11 and the metal electrode of the wiring board in the air. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007027346-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I579992-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014146658-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I500092-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007165671-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101113438-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9132496-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5449145-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4577130-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007266054-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4742844-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101233282-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8318585-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017216299-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009133919-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4733587-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6926190-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7473476-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008034683-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9620470-B2 |
| priorityDate |
2000-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |