abstract |
(57) [Abstract] [Problem] A good embedding property into a contact hole, Provided is a semiconductor device which suppresses a short circuit failure with an upper connected layer and an increase in contact resistance with a lower connected layer. A semiconductor device includes a first connected layer, an interlayer insulating film disposed on the first connected layer, and a second connected layer disposed on the interlayer insulating film. Connection layer (3a, 3 b) and a contact plug (4a, 4b) disposed in the interlayer insulating film 2 and connecting between the first connected layer 1 and the second connected layer (3a, 3b). The contact plug (4a, 4b) is connected to the second connected layer (3a, 3b). Inclined part 6 with a side wall 5 with an inclination that extends towards And the upper end face (7a, 7a, 9b) which is in contact with the second connected layer (3a, 3b), 7b). |