http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001230550-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-26 |
| filingDate | 2000-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_33b47458625973ca638dace0b13f33cf |
| publicationDate | 2001-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001230550-A |
| titleOfInvention | Method of manufacturing circuit board for multilayer printed wiring board |
| abstract | PROBLEM TO BE SOLVED: To provide a method for manufacturing a double-sided / single-sided circuit board for a multilayer printed wiring board, which can reduce the manufacturing cost and stabilize the interlayer connection resistance. SOLUTION: A non-through hole 18 reaching the copper foil is formed by irradiating a laser from the other surface of the insulating base material 10 having the copper foil 12 adhered on one surface, and a conductive paste is formed in the non-through hole 18. 20 is filled by vacuum pressure defoaming to form a via hole 2. 2 is formed, and then the copper foil 24 is heat-pressed to cover the conductive paste exposed from the other surface of the insulating base material 10, and the copper foils 12, 24 attached to both surfaces of the insulating resin are etched. Thus, a double-sided circuit board 30 having the conductor circuits 26 and 28 is manufactured. Similarly, the conductor foil 34 is formed by etching the copper foil of the insulating base material 10 having the copper foil 12 adhered to one side, and irradiating the laser from the other side of the insulating base material 10 to the conductive circuit 34. A single-sided circuit board 40 is manufactured by forming a non-through hole 18 that reaches and filling a conductive paste 20 in the non-through hole 18 by vacuum pressure degassing to form a via hole 22. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101470957-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003133743-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015199330-A |
| priorityDate | 1999-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.