| abstract |
(57) [Problem] To provide a resist that can form a resist with good pattern accuracy by a photographic method by developing using an alkaline aqueous solution and exhibit sufficient heat resistance and flexibility by processing at a low temperature. Provided is a resin composition. Kind Code: A1 An organopolysiloxane having an epoxy group-containing organic group represented by the structural formula (1), (b) a phenol novolak having at least one acryloyl group or methacryloyl group, and (c) photopolyfunctional. A diluent consisting of a monomer or a polyfunctional monomer having a light and heat functional group, or a diluent using these monomers in combination, and (d) a photopolymerization initiator are blended as essential components. |