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filingDate 2000-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af84889c693511b4e26be6e85976b79d
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publicationDate 2001-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001192643-A
titleOfInvention Semiconductor manufacturing equipment seal
abstract (57) Abstract: An object of the present invention is to provide a seal for a semiconductor manufacturing apparatus excellent in oxygen-resistant plasma characteristics, gas permeability, and sealability. The object is to provide a vinylidene fluoride-propylene hexafluoride copolymer or a vinylidene fluoride-propylene hexafluoride-tetrafluoroethylene copolymer 10 Semiconductor production characterized in that 40 to 150 parts by weight of barium sulfate is mixed with 0 part by weight, and a composition in which an inorganic substance other than barium sulfate is reduced to 1 part by weight or less is crosslinked with an organic peroxide. Solved by device seals. Further, the problem is solved by a seal for a semiconductor manufacturing apparatus in which 0.5 to 30 parts by weight of an ethylene tetrafluoride resin is further added to the composition.
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