http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001168497-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B08B7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05H1-24 |
filingDate | 1999-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_33b47458625973ca638dace0b13f33cf |
publicationDate | 2001-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2001168497-A |
titleOfInvention | Plasma cleaning equipment |
abstract | (57) Abstract: A circuit board to be desmeared, which has a relatively low heat-resistant temperature and does not thermally damage a B-stage epoxy adhesive, a PET film, or the like, is provided in an opening formed in the circuit board. To provide a plasma cleaning device capable of effectively removing a residual resin residue. A first electrode electrically grounded and a second electrode on which a high-frequency current is applied and a resin material to be cleaned is placed are arranged in a chamber filled with a reaction gas. A plasma cleaning apparatus comprising: means for cooling the second electrode; Means for efficiently dissipating the heat received by the resin material to the second electrode were provided on the second electrode. |
priorityDate | 1999-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 20.