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filingDate 1999-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f57a79c600580b7e7f0cf6aa66567828
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publicationDate 2001-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001160657-A
titleOfInvention Method of manufacturing group III nitride compound semiconductor laser
abstract PROBLEM TO BE SOLVED: To efficiently manufacture (mass-produce) a semiconductor laser which is easy, stable and reliable in circuit connection and free from problems such as poor connection of a negative electrode and high resistance. SOLUTION: RI from an uppermost surface Σ not covered with a mask a or a mask b to a part of an n-type semiconductor layer 103 is provided. BE treatment was performed. This etching process is performed at a vacuum level of 0.04 Torr. r, under the condition of high frequency power of 0.44 W / cm 2 , Ar gas and Cl 2 Performed by supplying gas. Thereafter, the surface exposed by this etching was further dry-etched using Ar gas. In these dry etching steps, the deposition surface of the negative electrode 107 on the n-type semiconductor layer 103 was exposed. The subsequent etching with Ar is performed as a post-treatment of RIBE with the chlorine-based gas described above. Thereafter, the mask a and the mask b were removed with a solvent. Through the above steps, a resonator standing substantially vertically and a tapered portion having an inclination angle φ of about 60 ° were simultaneously formed.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009044031-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8420424-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010512661-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014038322-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008060286-A
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