http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001156042-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 |
filingDate | 1999-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_16ce6623d869f61c92efa644169123da http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_99b8f51f1c71ea90ed5d75629c4c945b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_02f3614432db49f8c5c7171bcc04a81b |
publicationDate | 2001-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2001156042-A |
titleOfInvention | Plasma processing equipment |
abstract | PROBLEM TO BE SOLVED: To provide a plasma processing capable of reducing the etching time by making the temperature of a semiconductor wafer uniform, making the etching characteristics uniform within the surface of the semiconductor wafer, and improving the temperature response of the electrostatic chucking electrode. Provide equipment. SOLUTION: A plate-like electrode block 1 and a flow path 6 through which a coolant for temperature control flows are formed inside the electrode block, In a plasma processing apparatus including a dielectric film 5 for electrostatically adsorbing a semiconductor wafer 4 on the surface of an electrode block and an electrostatic adsorption electrode having an electrode cover 3 mounted on the outer peripheral surface of the electrode block 1, a refrigerant flow is provided. The passage 6 is formed in the electrode block below the electrode cover. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015220385-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010272873-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011517734-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009032432-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8951352-B2 |
priorityDate | 1999-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.