| abstract |
(57) [Abstract] (with correction) [PROBLEMS] To provide a heat-resistant photosensitive resin composition which can be patterned with a low exposure amount and has a small shrinkage after the pattern processing. A heat-resistant photosensitive resin composition comprising (a) a polymer having a structural unit represented by the general formula (1), (b) a photosensitive agent, and (c) a solvent. (R1 is a divalent to octavalent organic group having at least 2 or more carbon atoms, R2 is a divalent to octavalent organic group having at least 2 or more carbon atoms, R3, R4, R5, R6 represents hydrogen, a monovalent alkyl group having 1 to 20 carbon atoms, or a monovalent organic group having 1 to 3 unsaturated bonds. Further, R5 and R6 are not all hydrogen. n is an integer from 3 to 100000; p and q each represent an integer from 0 to 4. r and s are from 0 to 2 Indicates an integer up to. ) |