| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8242
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 |
| filingDate |
2000-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e96ff8279eac2e81eaf492c8b741f1ec
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8969436036053f406229ce110101392e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_012b0fbad0af039ad77e33d8964672b8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a198daf2fc7f6d55dbe08d67c2587cf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1397b1c20a985bdfe7d6d241a4d86f47 |
| publicationDate |
2001-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2001085644-A |
| titleOfInvention |
Method for manufacturing semiconductor device |
| abstract |
(57) Abstract: Provided is a means for easily cutting or adding a desired wiring formed on a semiconductor substrate. SOLUTION: As a method of manufacturing a semiconductor device having a predetermined circuit, a plurality of electrode pads connected to the circuit, and a plurality of program wirings composed of an uppermost wiring layer connected to the circuit, the method includes the steps of: An insulating film is formed on the program wiring, holes are formed on the plurality of electrode pads, and a voltage or a signal is applied to the plurality of electrode pads to test the function of the semiconductor device. A resist film is formed on the resist film, and an opening is formed in the resist film by irradiating a predetermined portion of the plurality of program wirings determined based on the test with an electron beam. A predetermined portion of the plurality of program lines is cut. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008111921-A |
| priorityDate |
2000-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |