http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001085516-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38520f366e74704305b34fb93a81121e
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76802
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
filingDate 1999-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_79121d51f9d084cfa214abdd157acd0b
publicationDate 2001-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001085516-A
titleOfInvention Method for manufacturing semiconductor device
abstract (57) [Summary] [PROBLEMS] To reduce wiring resistance without causing an accidental failure due to tolerance in a photolithography process. Provided is a manufacturing method for a semiconductor device. SOLUTION: An insulating film 15a for burying the conductive part 12 is formed so as to have a convex shape corresponding to the top of the convex conductive part 12. The insulating film 15a is covered with an etching stopper film 17 having an etching rate lower than the etching rate of the insulating film 15a. The protruding portion 17a of the etching stopper film 17 corresponding to the top of the protruding conductive portion 12 is partially removed, and the removed portion 17a of the etching stopper film 17 is selectively etched using an etching mask 19. Then, an etching hole 18 reaching the top of the convex conductive portion 12 is formed. A plug conductive portion 20 connected to the top of the convex conductive portion 12 is formed in the etching hole 18.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10049984-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11515257-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10418328-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9030014-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9337016-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011158319-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5684254-B2
priorityDate 1999-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6517
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457707758
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3084099
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419522015
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24261
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419555680

Total number of triples: 24.