| abstract |
(57) [Problem] To provide a gold plating solution having extremely excellent solution stability and a gold plating method using the same, for a non-cyanide electrolytic gold plating solution. SOLUTION: In the electrolytic gold plating solution containing a gold compound of a gold salt or a gold complex as a gold and containing a buffer, a chelating agent and a conductive salt, a hydantoin-based compound as a chelating agent in the plating solution is provided. It contained one selected from a uracil-based compound, succinimide and phthalimide. |