| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b00d726cb2cc5bef855c53991bf4038c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0235
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1017 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P15-0802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P15-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01C19-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B62D57-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P15-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P15-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P15-125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B25J7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-06 |
| filingDate |
1999-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_412601d6b5279648654700dc25ddddb0 |
| publicationDate |
2000-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2000343463-A |
| titleOfInvention |
Manufacturing method of micromachine |
| abstract |
An object of the present invention is to provide a method of manufacturing a spherical micromachine having a spherical body and a spherical shell surrounding the spherical body. A method of manufacturing a micromachine according to the present invention includes forming a sacrificial film to cover a sphere, forming a conductor pattern on the sacrificial film, and insulating to cover the conductor pattern. Forming a body film, forming holes in the insulator film to expose the conductor pattern, and forming a hole on the insulator film so as to connect to the conductor pattern exposed from the insulator film. Forming a wiring pattern; forming an insulating structural film so as to cover the sphere on which the wiring pattern is formed; and forming a plurality of etching holes reaching the sacrificial film from the outer surface of the structural film. And removing the sacrificial film from the etching hole by vapor phase etching. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2447773-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2498133-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008080888-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003046077-A |
| priorityDate |
1999-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |