| abstract |
(57) Abstract: (A) A polymer in which a resin which becomes alkali-soluble by reaction with an acid is cross-linked with an organic group having a tertiary ester structure, and the cross-link is cut by an acid. A positive resist composition comprising a compound, (B) a radiation-sensitive acid generator that generates an acid upon irradiation with radiation, and (C) an organic solvent. The positive resist material of the present invention is sensitive to high energy rays, has excellent sensitivity, resolution, and plasma etching resistance, and also has excellent heat resistance and reproducibility of the resist pattern. |