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filingDate 1999-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9458b105dc732bd4e53c6dd1ad8db98
publicationDate 2000-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000150508-A
titleOfInvention Method for forming insulating film of semiconductor device
abstract (57) [Problem] To provide an insulating film forming method which is an essential step of manufacturing a metal oxide semiconductor device. According to the method of forming an insulating film of a semiconductor device of the present invention, after cleaning a silicon wafer, loading the silicon wafer into a furnace, and supplying heavy water to the furnace to grow an insulating film on the silicon wafer. And the step of causing
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006022326-A1
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priorityDate 1998-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 28.