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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01B7-19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
filingDate 1998-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0d7fcc1f0ff93d78e2770ed1a614d73c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_998a101b4c3a815eb454bf8f68ae0c95
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publicationDate 2000-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000143213-A
titleOfInvention Supply method of semiconductor processing gas
abstract (57) [Problem] To provide a semiconductor processing gas supply method capable of suppressing corrosion of equipment and piping in a gas supply system or a semiconductor manufacturing facility by generating hydrogen fluoride and moisture at a processing location. I do. SOLUTION: A fluorine-containing gas such as fluorine, chlorine fluoride, bromine fluoride, iodine fluoride and a substance having hydrogen and oxygen atoms such as hydrogen peroxide, water, alcohols and the like are used for semiconductor manufacturing equipment. Are supplied individually to the processing section, and hydrogen fluoride and moisture are generated in the processing section.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7201807-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009213946-A
priorityDate 1998-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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