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filingDate 1998-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2000-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000119487-A
titleOfInvention Epoxy resin composition for semiconductor encapsulation and semiconductor device obtained using the same
abstract (57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation having good moldability and workability, and capable of obtaining a semiconductor device excellent in solder resistance and low stress property. The following epoxy compound (component (A)): Hardener [(B) component] and inorganic filler [(C) component] And a butadiene-based rubber particle (component (D)). (A) A biphenol (a1) represented by the following general formula (1) and a polyhydric phenol (a2) other than the biphenol (a1) are mixed in a weight mixing ratio (a1 / a2). An epoxy compound obtained by subjecting a mixed polyhydric phenol obtained by mixing at a ratio of 1 / a2 = 5/95 to 40/60 to epihalohydrin by addition reaction and ring closure reaction. Embedded image
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4696372-B2
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