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filingDate 1999-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2000-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000114607-A
titleOfInvention Method of manufacturing an infrared sensor
abstract (57) [Summary] [PROBLEMS] To enable a beam sensor to be manufactured with precisely reproducible characteristics, and to be capable of being arranged at a small interval independent of the thickness of a substrate used. A beam sensor with individual sensor elements can be manufactured. SOLUTION: At least one region 12 where an opening 4 is to be formed in a semiconductor substrate 1 is set on the surface of the semiconductor substrate. Next, a film 13 is deposited on the surface. Further, the beam absorber 5 is attached to the setting area 12 on the film 13. Further, a thermocouple 6 having a thermal contact that is in thermal contact with the beam absorber 5 and a cold junction 7 that is in thermal contact with the semiconductor substrate 1 is attached. In this case, openings are formed in the film 13 in the setting region 12, and the semiconductor substrate 1 is etched through the openings.
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