| abstract |
(57) [Problem] To form a resist with high pattern accuracy by a photographic method by developing using an aqueous alkaline solution, and exhibiting sufficient heat resistance and flexibility by processing at a low temperature. Provided is a resin composition for a resist. (A) an oligosiloxane structure represented by the structural formula (1) in a molecule, and an epoxy equivalent of 80 to 50; A difunctional agent comprising a polyfunctional epoxy resin which is 0, (b) a phenol novolak having at least one acryloyl group or methacryloyl group, (c) a photofunctional monomer, or a polyfunctional monomer having a light and thermal functional group, or A diluent using those monomers in combination, and (D) Photopolymerization initiator is blended as an essential component. Embedded image |