http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000100806-A

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filingDate 1999-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c48aecb90787246feecfb8448d8f038
publicationDate 2000-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000100806-A
titleOfInvention Method for manufacturing semiconductor device
abstract [PROBLEMS] To provide a method for manufacturing a semiconductor device capable of preventing the growth of a natural oxide film and the generation of contaminant particles even when a number of unit processes are sequentially performed. The method of manufacturing a semiconductor device according to the present invention includes the step of forming a first conductive layer on a semiconductor substrate in a method of manufacturing a semiconductor device using a semiconductor processing apparatus having at least one reactor module. Patterning and etching the first conductive layer to form the lower electrode 230; and applying a chemical vapor deposition process to the capacitor dielectric layer 2 on the lower electrode 230 in a reactor of the processing apparatus. The method includes a step of forming the upper electrode 250 and a step of forming the upper electrode 250 on the capacitor dielectric film 240, and a part or all of the steps can be performed consistently.
priorityDate 1998-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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