| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4964ada6006caac1715f7f32f5df380 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76819
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5329
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 |
| filingDate |
1985-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b9e571ecb0002b2b03e9f3df6d2833a9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb6e47102c1dce9cce84767a14a9b1f5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0974c1b2af66a4fc0819bef28c41d207 |
| publicationDate |
1987-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
FR-2588417-A1 |
| titleOfInvention |
METHOD FOR FORMING MULTILAYER METALLIC NETWORK FOR INTERCONNECTING COMPONENTS OF INTEGRATED CIRCUIT OF HIGH DENSITY AND INTEGRATED CIRCUIT BY RESULTING |
| abstract |
PROCESS FOR FORMING A MULTI-LAYER METAL NETWORK FOR THE INTERCONNECTION OF THE COMPONENTS OF AN INTEGRATED HIGH-DENSITY CIRCUIT AND THE RESULTING INTEGRATED CIRCUIT. BEFORE THE FORMATION OF THE UPPER METAL LAYER 25 ON THE DIELECTRIC LAYER 18 WHICH COVERS A BOTTOM METAL LAYER 15 INCLUDING 16 CONDUCTORS WITH STRAIGHT SIDES, WE APPROXIMATELY FILL THE GAPS PRESENT IN THE INTERVALS 17 BETWEEN THE SLECTOR CONDUCTORS 16, BY EXTENDING A DIFFERENCE OF A 21 AND BY ANNULING THE SUSPENSION. |
| priorityDate |
1985-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |