http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3161861-A1

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filingDate 2015-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2017-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-3161861-A1
titleOfInvention Anisotropic etch of copper using passivation
abstract A method for anisotropically etching a feature in a Cu-containing layer includes providing a substrate having a Cu-containing layer and a patterned etch mask formed on the Cu-containing layer such that on exposed Cu-containing layer is exposed to processing through the patterned etch mask, passivating a first surface of the exposed Cu-containing layer, and inhibiting passivation of a second surface of the Cu-containing layer. A Cu compound is formed on said second surface of the Cu-containing layer, and the Cu compound is removed from the second surface of the Cu-containing layer to anisotropically etch a feature in the Cu-containing layer.
priorityDate 2014-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 26.