| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcf39f6bd6f28a3eb1879af8fd8c341d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-02 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5313
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-10 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5313 |
| filingDate |
2015-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d6460ccb66bd8b652b6823987ea653b9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_260b771d7f0aee307222310768153b08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26867caf8f80960611fa89bdeb71b574 |
| publicationDate |
2016-02-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2985300-A1 |
| titleOfInvention |
Phosphor-containing phenol formaldehyde resin compound and flame-retardant epoxy resin hardener made from thereof |
| abstract |
The present disclosure provides a phosphor-containing phenol formaldehyde resin compound having a general formula (I):n n The compound is formed of a phenol formaldehyde resin and an aromatic phosphate compound by performing a condensation reaction, which may be used as a curing agent of an epoxy resin. The phenol formaldehyde resin is formed of a phenolic compound, a bisphenol compound and formaldehyde. The present disclosure further provides a phosphor-containing phenol formaldehyde resin cured material which is formed of the phosphor-containing phenol formaldehyde resin compound and an epoxy resin under a high temperature. The phosphor-containing phenol formaldehyde resin compound is added separately or mixed with an epoxy resin curing agent. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3093315-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105754287-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105754287-B |
| priorityDate |
2014-08-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |