| abstract |
Epoxy resin mixtures for the production of prepregs and composite (laminate, sandwich, multilayer) materials which can be obtained inexpensively and are readily processable give - without the addition of flameproofing agents - low combustibility moulded materials having a high glass transition temperature and simultaneously improved interlaminar adhesion and Cu adhesion if they contain the following components: - a phosphorus-modified epoxy resin having an epoxide value of from 0.02 to 1 mol/100 g, built up from structural units derived from (A) polyepoxide compounds containing at least two epoxide groups per molecule, and (B) at least one compound from the group consisting of phosphinic acids, phosphonic acids, pyrophosphonic acids and phosphonic acid monoesters, and - an aromatic polyamine as curing agent. mp |