| abstract |
Method for manufacturing an optoelectronic device (10) including a semiconductor substrate (14), pads (20) on a surface (18) of the substrate, semiconductor elements (24) each being in contact with a pad, and a dielectric region (22) extending in the substrate from said surface and connecting, for each pair of pads, one pad to the other pad; the method comprising the successive steps of: depositing a layer (50) on the substrate; forming portions (52) on said layer; etching parts of said layer not being covered with said portions to form the pads; removing said portions; and nitriding the pads and the parts of the substrate not being covered with the pads, wherein the nitriding step comprises successively: a first step of nitriding the pads at a first temperature; and a second step of nitriding the parts of the substrate not being covered with the pads at a second, different temperature. |