| abstract |
The invention relates to a method for connecting substrates, for example parts to be joined or particles, comprising depositing a plasma polymer layer on each of a first and a second substrate by means of atmospheric pressure plasma and bringing the plasma polymer layers in contact with each other. In a variant of the method, only the first substrate is provided with a plasma polymer layer and connected to a second substrate, the surface of which can react with the plasma polymer layer. The invention further relates to composite structures which can be obtained with such a method. The method according to the invention is based on the surprising finding that plasma polymer layers deposited by means of atmospheric pressure plasma allow an in particular bonded connection of substrates by bringing the plasma polymer layer(s) merely in contact with the second substrate. For this purpose, no additional auxiliary agent, and in particular no adhesive, is required. |