| abstract |
A chemical mechanical polishing (CMP) composition comprising n(A) inorganic particles, organic particles, or a mixture or composite thereof, n(B) a glycoside of the formulae 1 to 6 nwherein R 1 is alkyl, aryl, or alkylaryl, nR 2 is H, X1, X2, X3, X4, X5, X6, alkyl, aryl, or alkylaryl, nR 3 is H, X1, X2, X3, X4, X5, X6, alkyl, aryl, or alkylaryl, nR 4 is H, X1, X2, X3, X4, X5, X6, alkyl, aryl, or alkylaryl, nR 5 is H, X1, X2, X3, X4, X5, X6, alkyl, aryl, or alkylaryl, and the total number of monosaccharide units (X1, X2, X3, X4, X5, or X6) in the glycoside is in the range of from 1 to 20, nand n(C) an aqueous medium. |