| abstract |
In a conventional SGT production method, during dry etching for forming a pillar-shaped silicon layer and a gate electrode, an etching amount cannot be controlled using an end-point detection process, which causes difficulty in producing an SGT while stabilizing a height dimension of the pillar-shaped silicon layer, and a gate length. In an SGT production method of the present invention, a hard mask for use in dry etching for forming a pillar-shaped silicon layer is formed in a layered structure comprising a first hard mask and a second hard mask, to allow the end-point detection process to be used during the dry etching for the pillar-shaped silicon layer. In addition, a gate conductive film for use in dry etching for forming a gate electrode is formed in a layered structure comprising a first gate conductive film and a second gate conductive film, to allow the end-point detection process to be used during the dry etching for the gate electrode. |