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filingDate 2006-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2008-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-1881525-A1
titleOfInvention Etching method, method for producing dielectric film of low dielectric constant, method for producing porous member, etching system and thin film forming equipment
abstract To provide an etching method employing a novel CVD system and an etching apparatus applicable to the method. n In the etching method, performed are an adsorption step of employing halogen radicals generated from a halogen through formation of a plasma thereof, and a precursor 24 formed from the halogen and a noble metal component generated through etching of a noble metal member 11 by the halogen radicals, wherein crystal nuclei of the precursor 24 are caused to be adsorbed on a substrate 3; and an etching step of anisotropically etching, in a thickness direction by the halogen radicals, a portion of the substrate 3 on which the crystal nuclei have been adsorbed.
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