| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8fa57e1a6fb0d708ac2c90d39b325fe8 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1136
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1639
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1641
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1868
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-185
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1608
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-204 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 |
| filingDate |
2007-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5031ecf4739573e8ad6af60b2970b46e |
| publicationDate |
2007-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1845170-A2 |
| titleOfInvention |
Method for manufacturing a conductor path structure and such a conductor path structure |
| abstract |
The invention relates to a method for producing a carrier material (2) in electroless metallization baths and to a printed conductor structure (1) produced by the method on the carrier material (2). For this purpose, the plate-shaped carrier material (2) is first exposed to a selective electromagnetic radiation (3) of a Nd: YAG laser to form the conductor track structures (1) on the carrier material (2) as highly reactive aluminum particles by breaking up finely divided in the carrier material (2 ) to produce non-conductive aluminum nitride contained. At the same time, nitrogen is released, which prevents unwanted oxidation of the aluminum particles. Subsequently, at least one copper layer is applied to the conductor track structure (1) without current. In this way, an accelerated method for adherent metallization of a surface structure in electroless baths is provided. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2906025-A1 |
| priorityDate |
2006-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |