| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2855
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-469
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-4763
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44 |
| filingDate |
2005-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9cd4d66a167415f3e602c69dd84d76e7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a3d525fd4794a04daa752b759dc0299
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b9c544d4ad54c077d7a26a1abc564556
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f6bb6f1e1e08d8a2815f7973ae2d187 |
| publicationDate |
2007-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1800335-A1 |
| titleOfInvention |
Homogeneous copper interconnects for beol |
| abstract |
Defects on the edge of copper interconnects for back end of the line semiconductor devices are alleviated by an interconnect that comprises an impure copper seed layer (440). The impure copper seed layer (440) covers a barrier layer (230), which covers an insulating layer (115) that has an opening. Electroplated copper fills the opening in the insulating layer (115). Through a chemical mechanical polish, the barrier layer (230), the impure copper seed layer (440) derived from an electroplated copper bath, and the electroplated copper are planarized to the insulating layer (115). |
| priorityDate |
2004-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |