http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1660954-A4

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filingDate 2004-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14d6270694cb061efd804b859f69fae3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a5367a8f5f7159ca1a751e1a6b953de0
publicationDate 2009-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-1660954-A4
titleOfInvention METHOD FOR PREVENTING THE CORROSION OF COPPER OR METALLIZED SURFACES OF CIRCUITS DURING SEMICONDUCTOR MANUFACTURING PROCESSES
abstract A treatment bath for use in the manufacture of copper plated or metallized semiconductor devices and a method of inhibiting corrosion of copper plated or metallized surfaces and circuitry in the semiconductor devices immersed in an aqueous fluid in a treatment bath comprising adding to the aqueous fluid an effective corrosion inhibiting amount of one or more aromatic triazole corrosion inhibitors; fluorometrically monitoring the concentration of aromatic triazole corrosion inhibitors in the aqueous fluid; and adding additional aromatic triazole corrosion inhibitor to the aqueous fluid to maintain an effective corrosion inhibiting concentration of the aromatic triazole corrosion inhibitor in the aqueous fluid.
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Total number of triples: 30.